Technology

advanced packaging

5 synchronized stories carry this tag.

NVIDIA invests $3.5 billion as MediaTek adopts NVLink Fusion

NVIDIA invested $3.5 billion in MediaTek convertible bonds while the companies expanded collaboration across custom data-center XPUs, future RTX and DGX Spark chips, and automotive platforms. MediaTek will use NVLink Fusion as a design foundation for customer accelerators connected to NVIDIA rack-scale systems.

Why it matters: The agreement gives hyperscalers another semi-custom accelerator route while extending NVIDIA's interconnect, memory, packaging, manufacturing, and rack architecture deeper into partner-designed silicon.

Read storyOriginal source · nvidianews.nvidia.com

SK hynix breaks ground on its Indiana HBM packaging plant

SK hynix held the groundbreaking for a more than $4 billion advanced-packaging and research facility in West Lafayette, Indiana. The company plans to complete the cleanroom in the second half of 2028 and begin next-generation high-bandwidth-memory packaging and volume production in the second half of 2029, using wafers produced in Korea.

Why it matters: The project creates a dated construction milestone for a first US HBM packaging base, but it also makes clear how far announced AI-memory capacity remains from qualified, shipped supply.

Read storyOriginal source · news.skhynix.com

SpaceX and Tesla formally announce Terafab's $16.8 billion first phase

SpaceX and Tesla formally announced a $16.8 billion first phase for the planned Terafab chip complex in Texas; Grimes County, Intel involvement, and a possible $119 billion full buildout had been reported earlier.

Why it matters: The official first-phase figure advances a long-term custom-silicon plan, but does not create available fabrication, memory, packaging, or testing capacity.

Read storyOriginal source · reuters.com

US outlines 874 million dollars for AI infrastructure research

The Commerce Department signed letters of intent with seven companies for co-packaged optics, 3D memory, advanced packaging, thermodynamic sampling and supply-chain verification. Proposed support includes up to $300M for GlobalFoundries and $245M for Kepler.

Why it matters: Scaling AI depends on memory bandwidth, interconnects, packaging and energy efficiency, so public investment is moving beyond accelerators into the complete compute system.

Read storyOriginal source · nist.gov

IonQ agrees to acquire SkyWater Technology for 1.8 billion dollars

IonQ agreed to acquire semiconductor foundry SkyWater Technology in a cash-and-stock transaction valued at about 1.8 billion dollars. The companies said the combination would bring quantum design, fabrication, packaging, control systems, networking, and application software into one United States-based platform.

Why it matters: A leading quantum company moved to control more of its manufacturing stack, reflecting the strategic importance of fabrication capacity and supply-chain sovereignty.

Read storyOriginal source · investors.ionq.com