SK hynix breaks ground on its Indiana HBM packaging plant
SK hynix held the groundbreaking for a more than $4 billion advanced-packaging and research facility in West Lafayette, Indiana. The company plans to complete the cleanroom in the second half of 2028 and begin next-generation high-bandwidth-memory packaging and volume production in the second half of 2029, using wafers produced in Korea.
Why it matters: The project creates a dated construction milestone for a first US HBM packaging base, but it also makes clear how far announced AI-memory capacity remains from qualified, shipped supply.